this is information on a product in full production. march 2013 doc id 17414 rev 5 1/9 9 hsp061-4ny8 4-line esd protection for high speed lines datasheet ? production data figure 1. functional schematic (top view) features ? flow-through routing to keep signal integrity ? ultralarge bandwidth: 6 ghz ? ultralow capacitance: 0.6 pf ? low time domain reflection ? low leakage current: 100 na at 25 c ? extended operating junction temperature range: -40 c to 150 c ? package size in mm: 2 x 1 x 0.5 ? rohs compliant benefits ? high esd robustness of the equipment ? suitable for high density boards complies with following standards ? mil-std 883g method 3015-7 class 3b: ?8 kv ? iec 61000-4-2 level 4: ? 8 kv (contact discharge) ? 15 kv (air discharge) applications the hsp061-4ny8 is designed to protect against electrostatic discharge on sub micron technology circuits driving: ? hdmi 1.3 and 1.4 ? digital video interface ? display port ? usb 3.0 ? serial ata description the hsp061-4ny8 is a 4-channel esd array with a rail to rail architecture designed specifically for the protection of high speed differential lines. the ultra-low variation of the capacitance ensures very low influence on signal-skew. the large bandwidth and the low reflection make it compatible with 5 gbps. the device is packaged in qfn-8l with a 400 m pitch, which minimizes the pcb area. qfn-8l package i/o 1 i/o 2 gnd i/o 3 i/o 4 internally not connected gnd internally not connected 1 2 4 5 6 8 3 7 www.st.com
characteristics hsp061-4ny8 2/9 doc id 17414 rev 5 1 characteristics table 1. absolute maximum ratings t amb = 25 c symbol parameter value unit v pp peak pulse voltage iec 61000-4-2 contact discharge iec 61000-4-2 air discharge 8 20 kv i pp repetitive peak pulse current (8/20 s) 3 a t j operating junction temperature range -40 to +150 c t stg storage temperature range -65 to +150 c t l maximum lead temperature for soldering during 10 s 260 c table 2. electrical characteristics t amb = 25 c symbol parameter test conditions min. typ. max. unit v br breakdown voltage i r = 1 ma 6 v i rm leakage current v rm = 3 v 100 na v cl clamping voltage iec 61000-4-2, +8 kv contact (i pp = 30 a), measured at 30 ns 18 v c i/o - gnd capacitance (input/output to ground) v i/o = 0 v, f = (200 mhz - 3000 mhz), v osc = 30 mv 0.5 0.6 pf ? c i/o - gnd capacitance variation (input/output to ground) v i/o = 0 v f = 1 mhz, v osc = 30 mv 0.03 0.05 pf f c cut-off frequency -3db 6 ghz z diff differential impedance t r = 200 ps (10 - 90%) (1) z 0 diff = 100 ? 85 100 115 ? 1. hdmi specification conditions. this information can be provided for other applications. please contact your local st office.
doc id 17414 rev 5 3/9 hsp061-4ny8 characteristics figure 2. leakage current versus junction temperature (typical values) figure 3. s21 attenuation measurement tj (c) 0.01 0.10 1.00 10.00 25 50 75 100 125 150 i r (na) v r =v rm = 3 v 10 mhz 30 mhz 100 mhz 300 mhz 1 ghz 3 ghz -12 -9 -6 -3 0 -12 -9 -6 -3 0 db f (hz) figure 4. differential impedance (z diff ) (1) figure 5. eye diagram - hdmi mask at 3.4 gbps per channel (1) 1. hdmi specification conditions. this information can be provided for other applications. please contact your local st office. tr = 200 ps (10% - 90%) 12.5 /div z 0diff = 100 vertical : 200 mv / div horizontal : 50 ps / div figure 6. esd response to iec 61000-4-2 (+8 kv contact discharge) figure 7. esd response to iec 61000-4-2 (-8 kv contact discharge) 50 v / div 20 ns / div 20 gs / s 50 v / div 20 ns / div 20 gs / s
package information hsp061-4ny8 4/9 doc id 17414 rev 5 2 package information ? epoxy meets ul94, v0 ? lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions a nd product status are available at: www.st.com . ecopack ? is an st trademark. figure 8. qfn-8l di mension definitions table 3. qfn-8l dimensions ref dimensions millimeters inches min typ max min typ max a 0.45 0.50 0.55 0.018 0.020 0.022 a1 0.00 0.02 0.05 0.00 0.001 0.002 b 0.15 0.20 0.25 0.006 0.008 0.010 d 1.95 2.00 2.05 0.077 0.079 0.081 e 0.95 1.00 1.05 0.037 0.039 0.041 e 0.35 0.40 0.45 0.014 0.016 0.018 l 0.25 0.35 0.45 0.010 0.014 0.018 m 0.40 0.016 n 0.15 0.006 p 0.11 0.004 r 0.05 0.002 e b l pin 1 id d e a a1 p r m n
doc id 17414 rev 5 5/9 hsp061-4ny8 package information note: product marking may be rotated by multiples of 90 for assembly plant differentiation. in no case should this product marking be used to orient the component for its placement on a pcb. only pin 1 mark is to be used for this purpose. figure 11. qfn-8l tape and reel specification figure 9. footprint recommendations (dimensions in mm) figure 10. marking . . . . according to ipc7351 0.4 1.4 1.8 0.4 0.2 0.55 h 4 n dot identifying pin a1 location user direction of unreeling all dimensions are typical values in mm 4.0 4.0 2.0 8.0 1.75 3.5 ? 1.55 0.63 1.17 0.22 2.17 h 4 n h 4 n h 4 n
recommendation on pcb assembly hsp061-4ny8 6/9 doc id 17414 rev 5 3 recommendation on pcb assembly figure 12. recommended stencil window position 3.1 solder paste 1. use halide-free flux, qualification rol0 according to ansi/j-std-004. 2. ?no clean? solder paste recommended. 3. offers a high tack force to resist component displacement during pcb movement. 4. use solder paste with fine particle s: powder particle size 20-45 m. 3.2 placement 1. manual positioning is not recommended. 2. it is recommended to use th e lead recognition ca pabilities of the placement system, not the outline centering. 3. standard tolerance of 0.05 mm is recommended. 4. 3.5 n placement force is recommended. too much placement force can lead to squeezed out solder paste and cause solder joints to short. too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. to improve the package placement accuracy , a bottom side optical control should be performed with a high resolution tool. 6. for assembly, a perfect supporting of th e pcb (all the more on flexible pcb) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. footprint stencil window footprint copper thickness: 100 m 200 m 550 m 530 m 186 m 10 m 10 m 7m 7m 200 m 550 m 530 m 186 m 10 m 10 m 7m 7m 13 m 13 m 400 m 700 m 674 m 374 m 13 m 13 m 13 m 13 m 400 m 700 m 674 m 374 m 13 m 13 m 200 m 700 m 674 m 186 m 7m 7m 13 m 13 m 200 m 700 m 674 m 186 m 7m 7m 13 m 13 m
doc id 17414 rev 5 7/9 hsp061-4ny8 recommendation on pcb assembly 3.3 pcb design 1. to control the solder paste amount, the closed via is recommended instead of open vias. 2. the position of tracks and open vias in the solder area should be well balanced. the symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. figure 13. printed circuit board layout recommendations 3.4 reflow profile figure 14. st ecopack ? recommended soldering reflow profile for pcb mounting note: minimize air convection currents in the reflow oven to avoid component movement. maximum soldering profile corresponds to the latest ipc/jedec j-std-020. 400 m 1 2 4 5 6 8 37 via to gnd via to gnd footprint pad pcb tracks 250 0 50 100 150 200 240 210 180 150 120 90 60 30 300 270 - 6c/s 240-245 c 2 - 3 c/s temperature (c) -2 c/s -3 c/s time (s) 0.9 c/s 60 sec (90 max)
ordering information hsp061-4ny8 8/9 doc id 17414 rev 5 4 ordering information figure 15. ordering information scheme 5 revision history table 4. ordering information order code marking (1) 1. the marking can be rotated by multiples of 90 to differentiate assembly location package weight base qty delivery mode hsp061-4yn8 h4n qfn-8l 2.77 mg 6000 tape and reel (7?) hsp 06 1 - 4 ny8 high speed line protection breakdown voltage version number of lines package qfn-8l table 5. document revision history date revision changes 20-apr-2010 1 initial release. 15-oct-2010 2 updated values for ? c i/o - gnd in table 2 . updated figure 13 . updated package name. 29-mar-2012 3 updated table 2. updated weight value in table 4 . 19-oct-2012 4 added iec 61000-4-2 air discharge parameter in table 1 . added grid to figure 14 for easier reading of values. 27-mar-2013 5 added notes on marking rotation.
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